Main Article Content
Bonding is a widely used technique especially for composite assemblies. The quality of bonding depends on many parameters. The bonding strength is a global and one of the most important parameters in bonding quality assessment. Guided ultrasonic waves have been used in the last decades to assess the bond quality, or by detecting a weak adhesion, cracks, etc. Guided waves require a well-adapted mathematical and numerical model to simulate the measurable parameters in the real case. Among these models, the elastic interface represented by a distribution of springs, was used to model the whole adhesive layer or only the contact between layers. Weaker spring constants can represent local adhesion degradation. In the present paper we investigate the applicability limits of this model in the particular case of shear-horizontal (SH) waves.
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